3M participates in JOINT3, a next-generation semiconductor packaging consortium
3M has joined the next-generation semiconductor packaging consortium JOINT3, an effort to bring together global leaders in semiconductor materials, equipment and design. https://mma.prnewswire.com/media/2773531/Joint3_diagram.jpg JOINT3 is a co-creation evaluation platform established by Japan-based Resonac Corporation with the aim of accelerating the development of tools optimized for panel-level organic interposers, the thin layers made from organic materials […]